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Rigid Carbon-Fibre Felt Boards

Needled PAN carbon felt rigidised with phenolic or CVI carbon matrix; density 0.18–0.25 g cm⁻³, usable to 2,200 °C inert. Boards keep shape without external support.

Features

Low thermal conductivity – <0.15 W m⁻¹ K⁻¹ at 1,000 °C, cutting heat loss


Lightweight – 80 % lighter than solid graphite, easing furnace load


Good flexural strength – self-supporting up to 2 m span at 1,600 °C


Low out-gassing – total impurity <100 ppm after purification

Industrial Applications

Semiconductor

Semiconductor

Hot-zone insulation in CZ silicon pullers

Energy/Solar

Energy/Solar

Side and bottom insulation in directional-solidification furnaces

Aerospace

Aerospace

Re-entry heat-shield test fixtures

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